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| 2005 | ||
|---|---|---|
| 1 | EE | Jinwon Joo, Seungmin Cho, Bongtae Han: Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectronics Reliability 45(3-4): 637-646 (2005) |
| 1 | Seungmin Cho | [1] |
| 2 | Bongtae Han | [1] |