| |
| 2005 | ||
|---|---|---|
| 1 | EE | Jinwon Joo, Seungmin Cho, Bongtae Han: Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectronics Reliability 45(3-4): 637-646 (2005) |
| 1 | Bongtae Han | [1] |
| 2 | Jinwon Joo | [1] |