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Shu Yuan

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2006
2EEShu Yuan, Dongping Tian, Yanxing Zeng: 3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing. IEICE Transactions 89-C(5): 602-607 (2006)
2004
1EEDongping Tian, Shu Yuan, Tan Zheng: 3D reconstruction using spatial orthogonal constraints. ICARCV 2004: 1092-1097

Coauthor Index

1Dongping Tian [1] [2]
2Yanxing Zeng [2]
3Tan Zheng [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)