2006 | ||
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2 | EE | Shu Yuan, Dongping Tian, Yanxing Zeng: 3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing. IEICE Transactions 89-C(5): 602-607 (2006) |
2004 | ||
1 | EE | Dongping Tian, Shu Yuan, Tan Zheng: 3D reconstruction using spatial orthogonal constraints. ICARCV 2004: 1092-1097 |
1 | Shu Yuan | [1] [2] |
2 | Yanxing Zeng | [2] |
3 | Tan Zheng | [1] |