| |
| 2007 | ||
|---|---|---|
| 3 | EE | Jianfeng Xu, Hong Li, Wen-Yan Yin, Junfa Mao, Le-Wei Li: Capacitance Extraction of Three-Dimensional Interconnects Using Element-by-Element Finite Element Method (EBE-FEM) and Preconditioned Conjugate Gradient (PCG) Technique. IEICE Transactions 90-C(1): 179-188 (2007) |
| 2 | EE | Jianfeng Xu, Wen-Yan Yin, Junfa Mao, Le-Wei Li: Thermal Effect Simulation of GaN HFETs under CW and Pulsed Operation. IEICE Transactions 90-C(1): 204-207 (2007) |
| 2006 | ||
| 1 | EE | Hong Li, Wen-Yan Yin, Junfa Mao: Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for Circuit Simulations and a Comparison With Cu Interconnects for Sealed Technologies". IEEE Trans. on CAD of Integrated Circuits and Systems 25(12): 3042-3044 (2006) |
| 1 | Hong Li | [1] [3] |
| 2 | Le-Wei Li | [2] [3] |
| 3 | Junfa Mao | [1] [2] [3] |
| 4 | Jianfeng Xu | [2] [3] |