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2005 | ||
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1 | EE | Edward J. Yarmchuk, Christopher W. Cline, Dominic C. Bruen: Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects. IBM Journal of Research and Development 49(4-5): 677-686 (2005) |
1 | Dominic C. Bruen | [1] |
2 | Christopher W. Cline | [1] |