| |
| 2005 | ||
|---|---|---|
| 2 | EE | Edward J. Yarmchuk, Christopher W. Cline, Dominic C. Bruen: Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects. IBM Journal of Research and Development 49(4-5): 677-686 (2005) |
| 1 | EE | Dennis G. Manzer, John P. Karidis, Kathleen M. Wiley, Dominic C. Bruen, Christopher W. Cline, Charles Hendricks, Robert N. Wiggin, Yuet-Ying Yu: High-speed electrical testing of multichip ceramic modules. IBM Journal of Research and Development 49(4-5): 687-698 (2005) |
| 1 | Christopher W. Cline | [1] [2] |
| 2 | Charles Hendricks | [1] |
| 3 | John P. Karidis | [1] |
| 4 | Dennis G. Manzer | [1] |
| 5 | Robert N. Wiggin | [1] |
| 6 | Kathleen M. Wiley | [1] |
| 7 | Edward J. Yarmchuk | [2] |
| 8 | Yuet-Ying Yu | [1] |