Songbai Xue
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2006
1
Songbai Xue,
Yuxiu Wu
,
Zongjie Han
,
Ling Zhang
: Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices.
CGVR 2006
: 168-174
Coauthor
Index
1
Zongjie Han
[
1
]
2
Yuxiu Wu
[
1
]
3
Ling Zhang
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)