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Yuxiu Wu

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2006
1 Songbai Xue, Yuxiu Wu, Zongjie Han, Ling Zhang: Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. CGVR 2006: 168-174

Coauthor Index

1Zongjie Han [1]
2Songbai Xue [1]
3Ling Zhang [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)