| |
| 2008 | ||
|---|---|---|
| 1 | EE | Jian (Jessie) Wu, Xuekun Sun, Z. J. Pei, X. Jack Xin, Kelli Simmelink: Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments. IJMTM 13(2/3/4): 169-186 (2008) |
| 1 | Z. J. Pei | [1] |
| 2 | Kelli Simmelink | [1] |
| 3 | Xuekun Sun | [1] |
| 4 | Jian (Jessie) Wu | [1] |