| 2008 |
|---|
| 5 | EE | Jian (Jessie) Wu,
Xuekun Sun,
Z. J. Pei,
X. Jack Xin,
Kelli Simmelink:
Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments.
IJMTM 13(2/3/4): 169-186 (2008) |
| 2007 |
|---|
| 4 | EE | J. H. Liu,
Z. J. Pei,
G. R. Fisher:
Investigations of silicon wafer grinding using finite element analysis.
IJCAT 29(2/3/4): 102-107 (2007) |
| 3 | EE | Nikhi J. Churi,
Z. J. Pei,
Dustin C. Shorter,
Clyde Treadwell:
Rotary ultrasonic machining of silicon carbide: designed experiments.
IJMTM 12(1/2/3): 284-298 (2007) |
| 2005 |
|---|
| 2 | EE | Yue Jiao,
Ping Hu,
Z. J. Pei,
Clyde Treadwell:
Rotary ultrasonic machining of ceramics: design of experiments.
IJMTM 7(2/3/4): 192-206 (2005) |
| 1 | EE | Z. C. Li,
Y. Jiao,
T. W. Deines,
Z. J. Pei,
Clyde Treadwell:
Development of an innovative coolant system for rotary ultrasonic machining.
IJMTM 7(2/3/4): 318-328 (2005) |
