Thomas-Michael Winkel

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3EEHubert Harrer, Daniel M. Dreps, Thomas-Michael Winkel, Wolfgang Scholz, Bao G. Truong, Andreas Huber, Tingdong Zhou, Kenneth L. Christian, Gary F. Goth: High-speed interconnect and packaging design of the IBM System z9 processor cage. IBM Journal of Research and Development 51(1/2): 37-52 (2007)
2EEThomas-Michael Winkel, Wiren D. Becker, Hubert Harrer, Harald Pross, Dierk Kaller, Bernd Garben, Bruce J. Chamberlin, Scott A. Kuppinger: First- and second-level packaging of the z990 processor cage. IBM Journal of Research and Development 48(3-4): 379-394 (2004)
1EEHubert Harrer, Harald Pross, Thomas-Michael Winkel, Wiren D. Becker, Herb I. Stoller, Masakazu Yamamoto, Shinji Abe, Bruce J. Chamberlin, George A. Katopis: First- and second-level packaging for the IBM eServer z900. IBM Journal of Research and Development 46(4-5): 397-420 (2002)

Coauthor Index

1Shinji Abe [1]
2Wiren D. Becker [1] [2]
3Bruce J. Chamberlin [1] [2]
4Kenneth L. Christian [3]
5Daniel M. Dreps [3]
6Bernd Garben [2]
7Gary F. Goth [3]
8Hubert Harrer [1] [2] [3]
9Andreas Huber [3]
10Dierk Kaller [2]
11George A. Katopis [1]
12Scott A. Kuppinger [2]
13Harald Pross [1] [2]
14Wolfgang Scholz [3]
15Herb I. Stoller [1]
16Bao G. Truong [3]
17Masakazu Yamamoto [1]
18Tingdong Zhou [3]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)