| 2007 |
|---|
| 4 | EE | Hubert Harrer,
Daniel M. Dreps,
Thomas-Michael Winkel,
Wolfgang Scholz,
Bao G. Truong,
Andreas Huber,
Tingdong Zhou,
Kenneth L. Christian,
Gary F. Goth:
High-speed interconnect and packaging design of the IBM System z9 processor cage.
IBM Journal of Research and Development 51(1/2): 37-52 (2007) |
| 2004 |
|---|
| 3 | EE | Thomas-Michael Winkel,
Wiren D. Becker,
Hubert Harrer,
Harald Pross,
Dierk Kaller,
Bernd Garben,
Bruce J. Chamberlin,
Scott A. Kuppinger:
First- and second-level packaging of the z990 processor cage.
IBM Journal of Research and Development 48(3-4): 379-394 (2004) |
| 2002 |
|---|
| 2 | EE | Hubert Harrer,
Harald Pross,
Thomas-Michael Winkel,
Wiren D. Becker,
Herb I. Stoller,
Masakazu Yamamoto,
Shinji Abe,
Bruce J. Chamberlin,
George A. Katopis:
First- and second-level packaging for the IBM eServer z900.
IBM Journal of Research and Development 46(4-5): 397-420 (2002) |
| 1994 |
|---|
| 1 | | Hubert Harrer,
Josef A. Nossek,
Tamás Roska,
Leon O. Chua:
A Current-Mode DTCNN Universal Chip .
ISCAS 1994: 135-138 |
