ZhengJia Wang

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2008

1 EE ZhengJia Wang, Yuhui Wang, Zhouping Yin: A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging. ICIRA (2) 2008: 896-905

2008
1	EE	ZhengJia Wang, Yuhui Wang, Zhouping Yin: A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging. ICIRA (2) 2008: 896-905

Coauthor Index

1 Yuhui Wang [1]

2 Zhouping Yin [1]