| |
| 2001 | ||
|---|---|---|
| 1 | EE | Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov, Nikolai Iordanov: New assembling technique for BGA packages without thermal processes. Microelectronics Reliability 41(4): 611-615 (2001) |
| 1 | Radosvet Arnaudov | [1] |
| 2 | Nikolai Iordanov | [1] |
| 3 | Valentin Videkov | [1] |