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1991 | ||
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1 | EE | Tom Smy, R. Niall Tait, Michael J. Brett: Ballistic deposition simulation of via metallization using a quasi-three-dimensional model. IEEE Trans. on CAD of Integrated Circuits and Systems 10(1): 130-135 (1991) |
1 | Michael J. Brett | [1] |
2 | Tom Smy | [1] |