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R. Niall Tait

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1991
1EETom Smy, R. Niall Tait, Michael J. Brett: Ballistic deposition simulation of via metallization using a quasi-three-dimensional model. IEEE Trans. on CAD of Integrated Circuits and Systems 10(1): 130-135 (1991)

Coauthor Index

1Michael J. Brett [1]
2Tom Smy [1]

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