![]() |
| 2009 | ||
|---|---|---|
| 3 | EE | Valeriy Sukharev, Ara Markosian, Armen Kteyan, Levon Manukyan, Nikolay Khachatryan, Jun-Ho Choy, Hasmik Lazaryan, Henrik Hovsepyan, Seiji Onoue, Takuo Kikuchi, Tetsuya Kamigaki: Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation. ISQED 2009: 156-161 |
| 2005 | ||
| 2 | EE | Valeriy Sukharev: Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects. IEEE Trans. on CAD of Integrated Circuits and Systems 24(9): 1326-1335 (2005) |
| 2004 | ||
| 1 | EE | Valeriy Sukharev: Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect. ISQED 2004: 225-231 |
| 1 | Jun-Ho Choy | [3] |
| 2 | Henrik Hovsepyan | [3] |
| 3 | Tetsuya Kamigaki | [3] |
| 4 | Nikolay Khachatryan | [3] |
| 5 | Takuo Kikuchi | [3] |
| 6 | Armen Kteyan | [3] |
| 7 | Hasmik Lazaryan | [3] |
| 8 | Levon Manukyan | [3] |
| 9 | Ara Markosian | [3] |
| 10 | Seiji Onoue | [3] |