F. A. Stam

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2001

1 EE F. A. Stam, E. Davitt: Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. Microelectronics Reliability 41(11): 1815-1822 (2001)

2001
1	EE	F. A. Stam, E. Davitt: Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. Microelectronics Reliability 41(11): 1815-1822 (2001)

Coauthor Index

1 E. Davitt [1]