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C. Slob

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2005
1EEJ. de Vries, J. van Delft, C. Slob: 100 mum Pitch flip chip on foil assemblies with adhesive interconnections. Microelectronics Reliability 45(3-4): 527-534 (2005)

Coauthor Index

1J. van Delft [1]
2J. de Vries [1]

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