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| 2005 | ||
|---|---|---|
| 1 | EE | L. Zhang, G. Subbarayan, B. C. Hunter, D. Rose: Response surface models for efficient, modular estimation of solder joint reliability in area array packages. Microelectronics Reliability 45(3-4): 623-635 (2005) |
| 1 | B. C. Hunter | [1] |
| 2 | G. Subbarayan | [1] |
| 3 | L. Zhang | [1] |