| |
| 2009 | ||
|---|---|---|
| 1 | EE | Syed M. Alam, Robert E. Jones, Scott Pozder, Ankur Jain: Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology. ISQED 2009: 569-575 |
| 1 | Syed M. Alam | [1] |
| 2 | Ankur Jain | [1] |
| 3 | Robert E. Jones | [1] |