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Liang-Tien Lu

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2005
1EECho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee: Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). Microelectronics Reliability 45(12): 1916-1923 (2005)

Coauthor Index

1Cho-Liang Chung [1]
2Yao-Jung Lee [1]

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