M. B. Liu

2003
1	EE	M. B. Liu, G. R. Liu, K. Y. Lam: Computer Simulation Of Flip-Chip Underfill Encapsulation Process Using Meshfree Particle Method. International Journal of Computational Engineering Science 4(2): 405-408 (2003)

Coauthor Index

1	K. Y. Lam	[1]
2	G. R. Liu	[1]