Joseph Kuczynski
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2001
1
EE
Joseph Kuczynski,
Arvind K. Sinha
: Strain measurement and numerical analysis of an epoxy adhesive subjected to thermal loads.
IBM Journal of Research and Development 45
(6): 783-788 (2001)
Coauthor
Index
1
Arvind K. Sinha
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1
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Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)