| |
| 2006 | ||
|---|---|---|
| 2 | EE | J. Vobecký, D. Kolesnikov: The properties of aluminum, platinum silicide and copper based contacts for silicon high-power devices. Microelectronics Journal 37(3): 236-242 (2006) |
| 2005 | ||
| 1 | EE | J. Vobecký, D. Kolesnikov: Reliability of Contacts for Press-Pack High-Power Devices. Microelectronics Reliability 45(9-11): 1676-1681 (2005) |
| 1 | J. Vobecký | [1] [2] |