| 2007 |
|---|
| 3 | | Mei Dong,
Ronald Chung,
Edmund Y. Lam,
Kenneth S. M. Fung:
Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights.
IPCV 2007: 157-163 |
| 2 | EE | Jun Cheng,
Ronald Chung,
Edmund Y. Lam,
Kenneth S. M. Fung,
Yangsheng Xu:
Optimization of Bit-Pairing Codification with Learning for 3D Reconstruction.
Int. J. Image Graphics 7(3): 445-462 (2007) |
| 2006 |
|---|
| 1 | EE | Jun Cheng,
Ronald Chung,
Edmund Y. Lam,
Kenneth S. M. Fung:
Bit-pairing Codification for Binary Pattern Projection System.
ICPR (2) 2006: 263-266 |
