D. Fedasyuk
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2001
1
EE
D. Fedasyuk,
E. Levus
,
D. Petrov
: Flip-chip structure transient thermal model.
Microelectronics Reliability 41
(12): 1965-1970 (2001)
Coauthor
Index
1
E. Levus
[
1
]
2
D. Petrov
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
