| |
| 2003 | ||
|---|---|---|
| 1 | EE | Yubo Miao, Chong Ser Chong, Taichong Chai, Yu Chen, Quanbo Zou, Tie Yan, Chew-Kiat Heng, Tit Meng Lim: Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing. International Journal of Computational Engineering Science 4(2): 235-238 (2003) |
| 1 | Yu Chen | [1] |
| 2 | Chong Ser Chong | [1] |
| 3 | Chew-Kiat Heng | [1] |
| 4 | Tit Meng Lim | [1] |
| 5 | Yubo Miao | [1] |
| 6 | Tie Yan | [1] |
| 7 | Quanbo Zou | [1] |