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2003 | ||
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1 | EE | Yubo Miao, Chong Ser Chong, Taichong Chai, Yu Chen, Quanbo Zou, Tie Yan, Chew-Kiat Heng, Tit Meng Lim: Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing. International Journal of Computational Engineering Science 4(2): 235-238 (2003) |
1 | Yu Chen | [1] |
2 | Chong Ser Chong | [1] |
3 | Chew-Kiat Heng | [1] |
4 | Tit Meng Lim | [1] |
5 | Yubo Miao | [1] |
6 | Tie Yan | [1] |
7 | Quanbo Zou | [1] |