S. Barberan
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2005
1
EE
S. Barberan,
E. Auvray
: Die repackaging for failure analysis.
Microelectronics Reliability 45
(9-11): 1576-1580 (2005)
Coauthor
Index
1
E. Auvray
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1
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Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
