| |
| 2005 | ||
|---|---|---|
| 1 | EE | Sam Siau, Johan De Baets, André Van Calster, Leon Heremans, Sammy Tanghe: Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. Microelectronics Reliability 45(3-4): 675-687 (2005) |
| 1 | André Van Calster | [1] |
| 2 | Leon Heremans | [1] |
| 3 | Sam Siau | [1] |
| 4 | Sammy Tanghe | [1] |