| |
| 2001 | ||
|---|---|---|
| 1 | EE | Warren R. Anderson, William M. Gonzalez, Sheera S. Knecht, Wendy Fowler: Reliability considerations for ESD protection under wire bonding pads. Microelectronics Reliability 41(3): 367-373 (2001) |
| 1 | Wendy Fowler | [1] |
| 2 | William M. Gonzalez | [1] |
| 3 | Sheera S. Knecht | [1] |