| |
| 2004 | ||
|---|---|---|
| 1 | EE | Fang-Chung Yang, Chung-Hsien Kuo, Jein-Jong Wing, Ching-Kun Yang: Reconstructing the 3D solder paste surface model using image processing and artificial neural network. SMC (3) 2004: 3051-3056 |
| 1 | Chung-Hsien Kuo | [1] |
| 2 | Ching-Kun Yang | [1] |
| 3 | Fang-Chung Yang | [1] |