| |
| 2008 | ||
|---|---|---|
| 3 | EE | Feng Xu, Ting Wen, Keith A. Seffen, Tianjian Lu: Modeling of skin thermal pain: A preliminary study. Applied Mathematics and Computation 205(1): 37-46 (2008) |
| 2007 | ||
| 2 | Feng Xu, Ting Wen, Keith A. Seffen, Tianjian Lu: Characterization of Thermomechanical Behaviour of Skin Tissue II. Viscoelastic Behaviour. World Congress on Engineering 2007: 1417-1421 | |
| 1 | Feng Xu, Ting Wen, Keith A. Seffen, Tianjian Lu: Characterization of Thermomechanical Behaviour of Skin Tissue I. Tensile and Compressive Behaviours. World Congress on Engineering 2007: 1446-1450 | |
| 1 | Tianjian Lu | [1] [2] [3] |
| 2 | Keith A. Seffen | [1] [2] [3] |
| 3 | Feng Xu | [1] [2] [3] |