| |
| 2005 | ||
|---|---|---|
| 1 | EE | Grace Wang, S. Balakumar, S. C. Hwee, Rakesh Kumar, T. Hara: Enhancement of adhesion strength of Cu layer with low dielectric constant SiC: H liners in Cu interconnects. Microelectronics Journal 36(8): 749-753 (2005) |
| 1 | S. Balakumar | [1] |
| 2 | T. Hara | [1] |
| 3 | S. C. Hwee | [1] |
| 4 | Rakesh Kumar | [1] |