J. W. Wan

2007
2	EE	J. W. Wan, W. J. Zhang, D. J. Bergstrom: Recent advances in modeling the underfill process in flip-chip packaging. Microelectronics Journal 38(1): 67-75 (2007)
2005
1	EE	J. W. Wan, W. J. Zhang, D. J. Bergstrom: Influence of transient flow and solder bump resistance on underfill process. Microelectronics Journal 36(8): 687-693 (2005)

Coauthor Index

1	D. J. Bergstrom	[1] [2]
2	W. J. Zhang	[1] [2]