2005 | ||
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1 | EE | K. W. Tong, C. K. Kwong, C. Y. Chan: Process design for transfer moulding of electronic packages using a case-based reasoning approach with fuzzy regression adaptation. Int. J. Computer Integrated Manufacturing 18(1): 27-40 (2005) |
1 | C. Y. Chan | [1] |
2 | C. K. Kwong | [1] |