2008 | ||
---|---|---|
4 | EE | Ming Tie, Yushun Fan: HLA Based Multidisciplinary Collaborative Simulation Framework for Forging and Manipulating Process. ICIRA (1) 2008: 1256-1264 |
2007 | ||
3 | EE | Ming Tie, Jing Bi, Yushun Fan: Hybrid Intelligent Modeling Approach for the Ball Mill Grinding Process. ISNN (1) 2007: 609-617 |
2005 | ||
2 | EE | Yongfu Wang, Tianyou Chai, Lijie Zhao, Ming Tie: Compensating Modeling and Control for Friction Using RBF Adaptive Neural Networks. ISNN (3) 2005: 167-172 |
1 | EE | Ming Tie, Heng Yue, Tianyou Chai: A Hybrid Intelligent Soft-Sensor Model for Dynamic Particle Size Estimation in Grinding Circuits. ISNN (3) 2005: 871-876 |
1 | Jing Bi | [3] |
2 | Tianyou Chai | [1] [2] |
3 | Yushun Fan | [3] [4] |
4 | Yongfu Wang | [2] |
5 | Heng Yue | [1] |
6 | Lijie Zhao | [2] |