| 2008 |
|---|
| 4 | EE | Ming Tie,
Yushun Fan:
HLA Based Multidisciplinary Collaborative Simulation Framework for Forging and Manipulating Process.
ICIRA (1) 2008: 1256-1264 |
| 2007 |
|---|
| 3 | EE | Ming Tie,
Jing Bi,
Yushun Fan:
Hybrid Intelligent Modeling Approach for the Ball Mill Grinding Process.
ISNN (1) 2007: 609-617 |
| 2005 |
|---|
| 2 | EE | Yongfu Wang,
Tianyou Chai,
Lijie Zhao,
Ming Tie:
Compensating Modeling and Control for Friction Using RBF Adaptive Neural Networks.
ISNN (3) 2005: 167-172 |
| 1 | EE | Ming Tie,
Heng Yue,
Tianyou Chai:
A Hybrid Intelligent Soft-Sensor Model for Dynamic Particle Size Estimation in Grinding Circuits.
ISNN (3) 2005: 871-876 |
