| |
| 2000 | ||
|---|---|---|
| 1 | EE | Hiroyuki Tsukahara, Yoji Nishiyama, Fumiyuki Takahashi, Takashi Fuse, Toru Nishino, Moritoshi Ando: High-speed solder bump inspection system using a laser scanner and CCD camera. Systems and Computers in Japan 31(2): 94-102 (2000) |
| 1 | Moritoshi Ando | [1] |
| 2 | Takashi Fuse | [1] |
| 3 | Toru Nishino | [1] |
| 4 | Yoji Nishiyama | [1] |
| 5 | Hiroyuki Tsukahara | [1] |