N. F. Mohd Shukor
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2007
1
EE
H. Y. Wong
, N. F. Mohd Shukor,
N. Amin
: Prospective development in diffusion barrier layers for copper metallization in LSI.
Microelectronics Journal 38
(6-7): 777-782 (2007)
Coauthor
Index
1
N. Amin
[
1
]
2
H. Y. Wong
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
