Moo Whan Shin
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2007
1
EE
Jianzheng Hu
,
Lianqiao Yang
, Moo Whan Shin: Mechanism and thermal effect of delamination in light-emitting diode packages.
Microelectronics Journal 38
(2): 157-163 (2007)
Coauthor
Index
1
Jianzheng Hu
[
1
]
2
Lianqiao Yang
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
