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| 2003 | ||
|---|---|---|
| 1 | EE | S. Moghaddam, M. Rada, A. Shooshtari, M. Ohadi, Y. Joshi: Evaluation of analytical models for thermal analysis and design of electronic packages. Microelectronics Journal 34(3): 223-230 (2003) |
| 1 | Y. Joshi | [1] |
| 2 | S. Moghaddam | [1] |
| 3 | M. Ohadi | [1] |
| 4 | A. Shooshtari | [1] |