Herwig Kirchberger
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2008
1
EE
Herwig Kirchberger,
Paul Lindler
,
Markus Wimpliger
: Novel Bonding technologies for wafer-level transparent packaging of MOEMS
CoRR abs/0802.3103
: (2008)
Coauthor
Index
1
Paul Lindler
[
1
]
2
Markus Wimpliger
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
