![]() |
| 2008 | ||
|---|---|---|
| 2 | EE | Hyunjeong Park, Hyungsoo Kim, Jun So Pak, Changwook Yoon, Kyoungchoul Koo, Joungho Kim: Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network. IEICE Transactions 91-C(4): 595-606 (2008) |
| 2005 | ||
| 1 | EE | Joungho Kim, Junso Pak, Jongbae Park, Hyungsoo Kim: Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB. ISCAS (6) 2005: 5766-5769 |
| 1 | Joungho Kim | [1] [2] |
| 2 | Kyoungchoul Koo | [2] |
| 3 | Jun So Pak | [2] |
| 4 | Junso Pak | [1] |
| 5 | Hyunjeong Park | [2] |
| 6 | Jongbae Park | [1] |
| 7 | Changwook Yoon | [2] |