Gen-Wen Hsieh

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2005

1 EE Gen-Wen Hsieh, Ching-Hsiang Tsai, Wei-Chih Lin: Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arrays. Microelectronics Journal 36(7): 678-682 (2005)

2005
1	EE	Gen-Wen Hsieh, Ching-Hsiang Tsai, Wei-Chih Lin: Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arrays. Microelectronics Journal 36(7): 678-682 (2005)

Coauthor Index

1 Wei-Chih Lin [1]

2 Ching-Hsiang Tsai [1]