| |
| 2007 | ||
|---|---|---|
| 2 | EE | Z. J. Hou, P. Q. Ge, Y. F. Gao: The development of a wire saw for wafer slicing of single-crystal silicon. IJCAT 29(2/3/4): 187-190 (2007) |
| 1 | EE | J. F. Meng, P. Q. Ge, J. F. Li: The surface quality of monocrystalline silicon cutting using fixed abrasive diamond endless wire saw. IJCAT 29(2/3/4): 208-211 (2007) |
| 1 | Y. F. Gao | [2] |
| 2 | Z. J. Hou | [2] |
| 3 | J. F. Li | [1] |
| 4 | J. F. Meng | [1] |