Raymond A. Fillion
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1993
1
Wolfgang Daum
,
William E. Burdick Jr.
, Raymond A. Fillion: Overlay High-Density Interconnect: A Chips-First Multichip Module Technology.
IEEE Computer 26
(4): 23-29 (1993)
Coauthor
Index
1
William E. Burdick Jr.
[
1
]
2
Wolfgang Daum
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
