| |
| 2005 | ||
|---|---|---|
| 1 | EE | Soon-Young Oh, Jang-Gn Yun, Bin-Feng Huang, Yong-Jin Kim, Hee-Hwan Ji, Sang-Bum Huh, Han-Seob Cha, Ui-Sik Kim, Jin-Suk Wang, Hi-Deok Lee: Thermally Robust Nickel Silicide Process for Nano-Scale CMOS Technology. IEICE Transactions 88-C(4): 651-655 (2005) |
| 1 | Bin-Feng Huang | [1] |
| 2 | Sang-Bum Huh | [1] |
| 3 | Hee-Hwan Ji | [1] |
| 4 | Ui-Sik Kim | [1] |
| 5 | Yong-Jin Kim | [1] |
| 6 | Hi-Deok Lee | [1] |
| 7 | Soon-Young Oh | [1] |
| 8 | Jin-Suk Wang | [1] |
| 9 | Jang-Gn Yun | [1] |